Products
Cool-Off Thermal Release Dicing Tape DT021
Application
1.For use in electronic components LCD Glass Plate、LED、MLCC 、
Diode、Inductor、Semi-Conductor manufacturing processes, It performs the properties of Fixing and Dicing at room temperature,when temperature is raised above 130℃ it will lose adhesion and easy to release the dicing finished components.
2.For all kinds of temporary fixing and releasing processes.
Quality characteristics:
Material | Thickness | Roll Type Length | Released at room temperature |
PET Film | 0.15±0.02 mm | 50 ; 100 M | 30-100 g/25mm |
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