Products
Polyimide Soldering Tape PB428F
Application
Displaying good resistance to temperature, voltage and chemical,for fixing and photoexposure process of PCB.
Quality characteristics:
Material | Thickness | Adhesion Strength | Temp, Resist |
Polyimide Film | 0.060±0.005 mm | 0.60±0.2 Kg/25mm | 260 ℃ |
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P.S. If you want to obtain product specifications, please contact us through “Contact Us”.